Top Guidelines Of Noohapou
Top Guidelines Of Noohapou
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distant Locations: Static models are usually located remotely, increasing cost and lowering overall program efficiency.
thirty% of its peak electrical power consumption, giving our consumers significant reduction in working charges and improved reliability.
The information underneath is classified by semiconductor approach and Device maker. Each desk includes an purposes Matrix that displays qulified and commercial processes.
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This exceptional method, featuring a little kind issue, inexpensive-of-possession and Dynamic Temperature Command provided process and products engineers a new tool to optimize their temperature delicate procedures.
we have been guided inside our belief that prosperity On this competitive sector stems from providing prospects with really engineered new products and solutions and entire world class customer support.
All static TCUs need excess cooling & heating capacities because of their quite significant system fluid reservoirs. The process fuid reservoir on LAUDA-Noah's dynamic temperature Handle program is lower than one gallon.
With all the POU3300, you may achieve unparalleled brings about etch general performance, chamber uptime, minimized price of possession and fab Area utilization – all even though bettering your procedure trustworthiness.
the information pertains to a 300mm chamber temperature profile all through a superior element ratio Etch system, working at really substantial RF ability conditions (~three.8kW). The persuasive elements of this details set are:
LAUDA-Noah is Assembly these new worries and has included energy conserving technological innovation in systems which have been friendly to the natural environment and have a low priced to operate.
the info set here is from the more info 200mm volume manufacturing wafer fab and Obviously illustrates the benefit of the LAUDA-Noah POU process.
The POU3300 process offers dynamic temperature control of the process chamber cathode / electrode / anode and may be synchronized with any etch process.
the fact is correct Dynamic Temperature Regulate can only be realized when all 5 (5) of the following system structure and set up requirements are satisfied:
(as a result, putting in a static device next to chamber is not going to allow it to provide dynamic temperature Command)
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